Large Language Models (LLM) challenges: The emergence of large language models (LLMs) marks a milestone in AI, revolutionizing natural language processing (NLP) and related fields. Models like ...

Semiconductors are the critical component that enables our digital life. Their development has come a long way; In 1971, the Intel 4004, which was the first single-chip processor, had just 2,250 ...

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually ...

If the future were to be categorized in one word, it would be "data-centric". For decades, IC vendors have designed chips that have all functions integrated on the same die; however, scaling ...

The need for a circular economy has never been so urgent. Plastic consumption is expected to double globally by 2050, creating environmental and human health risks. Not only is plastic waste ...

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...

For 2.5D packaging, achieving high bandwidth relies on the redistribution layer (RDL) within the package, where features like Line/Space (L/S), via, and pad dimensions are important. However, ...

Creating a circular economy is an essential sustainability target for governments, brands, suppliers, and the public. A key driver is the risks that plastic consumption, which is expected to double ...

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually ...

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

BOSTON, Aug. 9, 2022 /PRNewswire/ -- If the future were to be categorized in one word, it would be "data-centric". For decades, IC vendors have designed chips that have all functions integrated on the ...